PCB Assembly & Manufacturing - Top 5 Mistakes in PCB Component Selection That Can Cause PCB Failure!

Print Circuit Boards (PCBs) are an essential part of most electronic and electrical devices in use today. 

The possibility of making a mistake during the PCB board assembly process occurs at any stage of the process; it could be the result of defects in the engineering architecture or operational errors. 

Although errors in the circuit board assembly process can occur for various causes, the following are five of the most common mistakes that are mainly responsible for PCB failures.

1. Flexion Breaking

When undue tension on a ceramic chip capacitor allows the Printed Circuit Board Assembly to bend excessively when pushed through it, it is called flex cracking. Ceramic chip capacitors are engineered to withstand a particular load; when the shipment produced by a PCB reaches its total capacity, stress is applied to the ceramic chip capacitor, allowing the PCB to bend. 

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It is vital to use the same or equivalent load level ceramic chip capacitor used in the design process during quick turn PCB assembly to ensure the capacitor does not come under stress and allow the PCB to bend or break, ultimately contributing to PCB output loss.

2. Non-Established Polarities

Custom PCB Assembly involves the use of various polarised materials, such as batteries and diodes. Marking each particular component’s polarity is critical for PCB assembly manufacturers to distinguish between anodes and cathodes. 

If the polarities are not explicitly identified or are poorly marked, the wrong polarity is more likely to be attached to the wrong terminal during the PCB manufacturing process. Short circuits in PCBs are often triggered by incorrect polarity and terminal contacts, which may cause the circuit to blow up or, at the very least, make specific components on the PCB inoperable.

3. Ineffective Copper-to-Edge Clearance 

Copper's high conductive properties make it an ideal metal for electrical and electronic Prototype PCB Manufacturing. However, copper is particularly prone to corrosion as a metal, which can occur as the copper layers are exposed to the atmosphere. 

To resist corrosion, copper used in Flexible PCB Assembly is often coated with other materials such as rubber. 

However, while trimming the printed circuit board, the copper coating is often trimmed. It exposes the layers underneath to the air and raises the likelihood of corrosion and PCB failure.

4. Plating Voids or Holes

The electroplating deposition process is a vital part of the PCB assembly process by PCB Prototype Manufacturers.  This PCB fabrication method is used to drill holes in the circuit board so that power can be carried from one end to the other. 

After the holes are drilled, a thin electroless copper coating is applied to the board and along the hole walls to serve as a foundation for the following layers that would be used for etching a printed circuit board. 

Errors during the deposition process can create holes in the copper plating, stopping electricity from going through the hole and allowing the entire PCB to collapse.

5. Misalignment of Components

Each part on a printed circuit board has a specified landing spot. Components may move away from their intended position during the soldering process by binding themselves to the molten solder. 

A misaligned portion will interrupt the proper flow of electricity through the circuit board, resulting in the total PCB’s failure. 

There are only a few cases where PCB makers can overlook the portion during the assembly phase, resulting in device failure.

The Bottom Line!

It is vital to check for mistakes during the component selection process! PCBGOGO is one of the most seasoned PCB and PCB assembly manufacturers, having been in business for over ten years. You can contact us right away!